【英文标准名称】:Mechanicalstandardizationofsemiconductordevices-Part6-21:Generalrulesforthepreparationofoutlinedrawingsofsurfacemountedsemiconductordevicepackages-Measuringmethodsforpackagedimensionsofsmalloutlinepackages(SOP)(IEC60191-6-
【原文标准名称】:半导体器件的机械标准化.第6-21部分:表面安装半导体器件封装外形图绘制的一般规则.小外形封装(SOJ)的封装尺寸规格测量方法(IEC60191-6
【标准号】:DINEN60191-6-21-2011
【标准状态】:现行
【国别】:德国
【发布日期】:2011-03
【实施或试行日期】:2011-03-01
【发布单位】:德国标准化学会(DE-DIN)
【起草单位】:
【标准类型】:()
【标准水平】:()
【中文主题词】:
【英文主题词】:Casedrawing;Components;Connectingdimensions;Connections;Design;Dimensions;Drawings;Electricenclosures;Electricalengineering;Electronicengineering;Electronicequipmentandcomponents;Enclosures;Engineeringdrawings;Erecting(constructionoperation);Gridsystems;Integratedcircuits;Marking;Measurement;Measuringtechniques;Mechanic;Packages;Semiconductordevices;Semiconductorpackage;Semiconductors;SMD;Surfacemounting;Surfacemountingdevices;Symbols;Types
【摘要】:
【中国标准分类号】:
【国际标准分类号】:01_100_25;31_240
【页数】:17P.;A4
【正文语种】:德语